Enhanced Thermal Conductivity for Maximum Cooling

The Thermal Heat Sink Paste-Gold (CPU002) ensures efficient heat transfer between your processor and heat sink. Its premium thermal compound fills microscopic air gaps to improve conductivity and maintain stable temperatures during heavy workloads or gaming sessions.

Key Features

• High thermal conductivity for optimal heat dissipation
• Eliminates air gaps between CPU and heat sink
• Stable performance under high temperatures
• Easy to apply and long-lasting formulation
• Ideal for CPUs, GPUs, and other high-performance components

Specifications

• Model: CPU002
• Type: Thermal Grease / Heat Sink Compound
• Colour: Gold
• Thermal Conductivity: High (optimized for CPU and GPU use)
• Operating Temperature Range: -50 °C to 200 °C
• Package: 1 × Syringe (approx. 1 – 2 g)

Application Note

Apply a thin, even layer between the CPU/GPU and heat sink to eliminate air pockets and improve cooling performance.